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Universitätsprofessor/in em./i.R., Elektronische Bauelemente und Schaltungen
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Die folgenden Publikationen sind in der Online-Universitätsbibliographie der Universität Duisburg-Essen verzeichnet. Weitere Informationen finden Sie gegebenenfalls auch auf den persönlichen Webseiten der Person.
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Modeling and Characterization of Adapted 3ω-Method for Thermal Conduction Measurement of Thermal Radiation SensorsIn: IEEE Sensors Letters Jg. 4 (2020) Nr. 7, 9119082Online Volltext: dx.doi.org/
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Monolithic Integration and Analysis of Vertical, Partially Encapsulated Nanoelectrode ArraysIn: Journal of Microelectromechanical Systems Jg. 29 (2020) Nr. 5, S. 1180 - 1188Online Volltext: dx.doi.org/
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Modeling of thermal conductivity for a CMOS-compatible MEMS-ROIC contact by TiN nanotubesIn: IEEE Transactions on Electron Devices (T-ED) Jg. 66 (2019) Nr. 8, S. 3485 - 3491Online Volltext: dx.doi.org/ (Open Access)
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Optimization of the dielectric layer for electrowetting on dielectricIn: Integration: The VLSI Journal Jg. 67 (2019) S. 50 - 59Online Volltext: dx.doi.org/ Online Volltext (Open Access)
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With PECVD deposited poly-SiGe and poly-Ge forming contacts between MEMS and electronicsIn: Journal of Electronic Materials (JEM) Jg. 48 (2019) Nr. 11, S. 7360 - 7365Online Volltext: dx.doi.org/
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Development of a Post-CMOS Compatible Nanoporous Thin Film layer Based on Al₂O₃
International Conference on Nanomaterials and Biomaterials (ICNB) ; 11–13 December 2017, Amsterdam, The Netherlands,In: IOP Conference Series: Materials Science and Engineering Jg. 350 (2018) Nr. 1, 012001Online Volltext: dx.doi.org/ (Open Access) -
Simulation Results of Prospective Next Generation 3-D Thermopile Sensor and Array Circuitry OptionsIn: IEEE Sensors Letters Jg. 2 (2018) Nr. 2, 2500604Online Volltext: dx.doi.org/
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Analytical model for thin-film SOI PIN-diode leakage currentIn: Solid State Electronics Jg. 130 (2017) S. 4 - 8Online Volltext: dx.doi.org/
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Fabrication and electrochemical characterization of ruthenium nanoelectrodesIn: Current Directions in Biomedical Engineering Jg. 3 (2017) Nr. 2, S. 393 - 396Online Volltext: dx.doi.org/ (Open Access)
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Study of enzyme sensors with wide, adjustable measurement ranges for in-situ monitoring of biotechnological processesIn: Sensors and Actuators B: Chemical Jg. 241 (2017) S. 48 - 54Online Volltext: dx.doi.org/
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Ungekühlte Mikrobolometer-Arrays mit einer Pixelgröße von 12 µm basierend auf einer neuartigen thermisch isolierenden Struktur
18. GMA/ITG-Fachtagung Sensoren und Messsysteme 2016 ; 10. - 11. Mai 2016, Nürnberg,In: Technisches Messen: tm Jg. 84 (2017) Nr. 6, S. 381 - 388Online Volltext: dx.doi.org/ -
Experimental reliability studies and SPICE simulation for EEPROM at temperatures up to 450°CIn: Journal of Microelectronics and Electronic Packaging Jg. 13 (2016) Nr. 1, S. 33 - 37Online Volltext: dx.doi.org/
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HOT-300 – a multidisciplinary technology approach targeting microelectronic systems at 300 C operating temperature
International Conference and Exhibition on High Temperature Electronics 2016 (HiTEC 2016) ; 10-12 May 2016, Albuquerque, New Mexico, USA,In: Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) (2016) S. 1 - 10Online Volltext: dx.doi.org/ -
Integrated multi-sensor system for parallel in-situ monitoring of cell nutrients, metabolites, cell density and pH in biotechnological processesIn: Sensors and Actuators B: Chemical Jg. 236 (2016) S. 937 - 946Online Volltext: dx.doi.org/
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Modeling of the charge transfer in a lateral drift field photo detectorIn: Solid State Electronics Jg. 126 (2016) S. 51 - 58Online Volltext: dx.doi.org/
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Enzyme sensor with polydimethylsiloxane membrane and CMOS potentiostat for wide-range glucose measurementsIn: IEEE Sensors Journal (J-SEN) Jg. 15 (2015) Nr. 12, S. 7096 - 7104Online Volltext: dx.doi.org/
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Experimental reliability studies and SPICE simulation for EEPROM at temperatures up to 450°C
International Conference on High Temperature Electronics Network 2015 (HiTEN 2015) ; 6 - 8 July 2015, Cambridge, UK,In: Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) (2015) S. 5 - 9Online Volltext: dx.doi.org/ -
Failure mechanisms of microbolometer thermal imager sensors using chip-scale packagingIn: Microelectronics Reliability Jg. 55 (2015) Nr. 9-10, S. 1901 - 1905Online Volltext: dx.doi.org/
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High-temperature trench capacitors, using thin-film ALD dielectrics
International Conference on High Temperature Electronics Network 2015 (HiTEN 2015) ; 6 - 8 July 2015, Cambridge, UK,In: Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) (2015) S. 130 - 133Online Volltext: dx.doi.org/ -
Integrated multi-sensor system for parallel in-situ monitoring of cell nutrients, metabolites and cell mass in biotechnological processesIn: Procedia Engineering Jg. 120 (2015) S. 372 - 375Online Volltext: dx.doi.org/ (Open Access)
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Reliability of microbolometer thermal imager sensors using chip-scale packagingIn: Procedia Engineering Jg. 120 (2015) S. 1191 - 1196Online Volltext: dx.doi.org/ (Open Access)
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Encapsulation of implantable integrated MEMS pressure sensors using polyimide epoxy composite and atomic layer depositionIn: Journal of Sensors and Sensor Systems (JSSS) Jg. 3 (2014) Nr. 2, S. 335 - 347Online Volltext: dx.doi.org/ (Open Access)
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PECVD of poly-SiGe/Ge layers with increased total gas flowIn: Microelectronic Engineering Jg. 115 (2014) S. 26 - 31Online Volltext: dx.doi.org/
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Reliability of CMOS on silicon-on-insulator for use at 250°CIn: IEEE Transactions on Device and Materials Reliability (T-DMR) Jg. 14 (2014) Nr. 1, S. 21 - 29Online Volltext: dx.doi.org/
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Zuverlässigkeitsuntersuchungen an einer hochtemperaturtauglichen SOI-CMOS-TechnologieIn: PLUS: Produktion von Leiterplatten und Systemen Jg. 16 (2014) Nr. 6, S. 1299 - 1308
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CMOS-compatible ruggedized high temperature Lamb wave pressure sensorIn: Journal of Micromechanics and Microengineering Jg. 23 (2013) Nr. 8, 085018Online Volltext: dx.doi.org/
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Galvanik in der MikrosystemtechnikIn: ATZ-Elektronik Jg. 8 (2013) Nr. 2, S. 88 - 93Online Volltext: dx.doi.org/
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High temperature characterization up to 450°C of MOSFETs and basic circuits realized in a Silicon-on-Insulator (SOI) CMOS-technologyIn: Journal of Microelectronics and Electronic Packaging Jg. 10 (2013) Nr. 2, S. 67 - 72Online Volltext: dx.doi.org/
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High temperature reliability investigations up to 350 °C of gate oxide capacitors realized in a Silicon-on-Insulator CMOS-technology
International Conference and Exhibition on High Temperature Electronics Network 2013 (HiTEN 2013) ; 8 - 10 July 2013, Oxford, UK,In: Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) (2013) S. 116 - 121Online Volltext: dx.doi.org/ -
Reliability investigations up to 350°C of gate oxid capacitors realized in a Silicon-on-Insulator CMOS technologyIn: Journal of Microelectronics and Electronic Packaging Jg. 10 (2013) Nr. 4, S. 150 - 154Online Volltext: dx.doi.org/
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A novel fully implantable wireless sensor system for monitoring hypertension patientsIn: IEEE Transactions on Biomedical Engineering (T-BME) Jg. 59 (2012) Nr. 11, S. 3124 - 3130Online Volltext: dx.doi.org/
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An improved electrical and thermal model of a microbolometer for electronic circuit simulationIn: Advances in Radio Science Jg. 10 (2012) S. 183 - 186Online Volltext: dx.doi.org/ (Open Access)
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High temperature characterization up to 450 °C of MOSFETs and basic circuits realized in a Silicon-on-Insulator (SOI) CMOS-technology
International Conference and Tabletop Exhibition on High Temperature Electronics 2012 (HiTEC 2012) ; May 8-10, 2012; Albuquerque, New Mexico, USA,In: Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) (2012) S. 227 - 232Online Volltext: dx.doi.org/ -
Quantum efficiency determination of a novel CMOS design for fast imaging applications in the extreme ultravioletIn: IEEE Transactions on Electron Devices (T-ED) Jg. 59 (2012) Nr. 3, S. 846 - 849Online Volltext: dx.doi.org/
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Simulation method for LWIR radiation distribution using a visual ray-tracer
International Conference on Numerical Simulation of Optoelectronic Devices (NUSOD) ; 5 - 8 Sept. 2011, Rome, Italy,In: Optical and Quantum Electronics Jg. 44 (2012) Nr. 3-5: Special Issue: Numerical Simulation of Optoelectronic Devices NUSOD'11, S. 297 - 301Online Volltext: dx.doi.org/ -
An uncooled VGA-IRFPA with novel readout architectureIn: Advances in Radio Science Jg. 9 (2011) S. 107 - 110Online Volltext: dx.doi.org/ (Open Access)
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High temperature reliability investigations of EEPROM memory cells realised in Silicon-on-Insulator (SOI) technology
International Conference on High Temperature Electronics Network 2011 (HiTEN 2011) ; 18 - 20 July 2011, Oxford, UK,In: Additional Conferences (Device Packaging, HiTEC, HiTEN, & CICMT) (2011) S. 221 - 225Online Volltext: dx.doi.org/ -
Light switched plasma charging protection device for high-field characterization and flash memory protectionIn: IEEE Transactions on Device and Materials Reliability (T-DMR) Jg. 11 (2011) Nr. 1, S. 81 - 85Online Volltext: dx.doi.org/
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Neue CMOS-Bildsensoren erweitern EinsatzmöglichkeitenIn: Labor-Praxis Jg. 35 (2011) Nr. 5, S. 22 - 24
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Simulating far-infrared scenarios with the radiance synthetic imaging systemIn: Computing in Science and Engineering (CiSE) Jg. 13 (2011) Nr. 4, S. 98 - 103Online Volltext: dx.doi.org/
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Lateral drift-field photodiode for low noise, high-speed, large photoactive-area CMOS imaging applications
New Developments in Radiation Detectors ; 11th European Symposium on Semiconductor Detectors (ESSD) ; 7-11 June 2009, Wildbad Kreuth, Germany,In: Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment Jg. 624 (2010) Nr. 2, S. 470 - 475Online Volltext: dx.doi.org/ -
Noise of short-time integrators for readout of uncooled infrared bolometer arraysIn: Advances in Radio Science Jg. 8 (2010) S. 129 - 133Online Volltext: dx.doi.org/ (Open Access)
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Ti/Ni(80%)Cr(20%) thin-film resistor with a nearly zero temperature coefficient of resistance for integration in a standard CMOS processIn: IEEE Electron Device Letters (L-ED) Jg. 29 (2008) Nr. 3, S. 212 - 214Online Volltext: dx.doi.org/
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Quality control of ultra-microelectrode arrays using cyclic voltammetry, electrochemical impedance spectroscopy and scanning electrochemical microscopy
Eighth International Meeting on Chemical Sensors (IMCS) ; 2 - 5 July 2000, Basel, Switzerland,In: Sensors and Actuators B: Chemical Jg. 76 (2001) Nr. 1-3, S. 573 - 581Online Volltext: dx.doi.org/ -
Optimization of vertical 600 and 1500 V SOI-ESTs with low on-state voltagesIn: Solid State Electronics Jg. 44 (2000) Nr. 12, S. 2131 - 2138Online Volltext: dx.doi.org/
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Entwicklung eines BICMOS-Smart-Power-Prozesses in lokaler SIMOX-TechnologieIn: Electrical Engineering Jg. 79 (1996) Nr. 5, S. 335 - 341Online Volltext: dx.doi.org/
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Reduction of heat loss of silicon membranes by the use of trench etching techniques
Eurosensors VII ; September 26 - 29, 1993, Budapest, Hungary,In: Sensors and actuators A: Physical Jg. 42 (1994) Nr. 1-3, S. 578 - 581Online Volltext: dx.doi.org/ -
Intelligente Sensoren auf dem Weg zum ASICIn: Markt und Technik (1993) Nr. 30, S. 24 - 26
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Novel approach to defect etching in thin film silicon-on-insulatorIn: Journal of the Electrochemical Society (JES) Jg. 140 (1993) Nr. 6, S. 1713 - 1716Online Volltext: dx.doi.org/
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Smart power technology with dielectric insulation : Processes and applicationsIn: Electron Technology: Internet Journal Jg. 26 (1993) Nr. 1, S. 83 - 93
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A miniature single-chip pressure and temperature sensorIn: Journal of Micromechanics and Microengineering Jg. 2 (1992) Nr. 3, S. 199 - 201Online Volltext: dx.doi.org/
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Dreidimensionale Mikrostrukturen eröffnen neue Anwendungen : Geringes Gewicht, kleinste Abmessungen durch Integration auf kleinstem RaumIn: Handelsblatt Jg. 47 (1992) Nr. 214, S. 30
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Integration of vertical/quasivertical DMOS, CMOS and bipolar transistors in a 50V SIMOX processIn: Microelectronic Engineering Jg. 19 (1992) Nr. 1-4, S. 733 - 735Online Volltext: dx.doi.org/
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Minimum oxygen dose for reliable application of SIMOXIn: Materials Science and Engineering B: Solid-State Materials for Advanced Technology Jg. 12 (1992) Nr. 1-2, S. 149 - 151Online Volltext: dx.doi.org/
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Performance of hydrogen-sensitive MOS capacitances with integrated on-chip signal conditioningIn: Sensors and Actuators B: Chemical Jg. 6 (1992) Nr. 1-3, S. 162 - 164Online Volltext: dx.doi.org/
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High-quality SOI-substrates for CMOS transistors
1st SIMOX Workshop ; 7 and 8 November 1988, Guildford, Surrey, UK,In: Vacuum Jg. 42 (1991) Nr. 5-6, S. 387 - 388Online Volltext: dx.doi.org/ -
JFET-PMOS technology, in the design of monolithic preamplifier systems for multielectrode detectorsIn: IEEE Transactions on Nuclear Science (T-NS) Jg. 38 (1991) Nr. 2, S. 69 - 76Online Volltext: dx.doi.org/
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Measurement of SOI film thicknessIn: Microelectronic Engineering Jg. 15 (1991) Nr. 1-4, S. 207 - 210Online Volltext: dx.doi.org/
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Silicon-on-insulator development in EuropeIn: Solid State Technology Jg. 34 (1991) Nr. 2, S. 79 - 83
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Leistungsschalter für 500 V mit dielektrisch isolierter CMOS-SignalelektronikIn: Mikro-Elektronik: me Jg. 4 (1990) Nr. 6, S. 256 - 259
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Trends in VLSI technologiesIn: Microelectronic Engineering Jg. 12 (1990) Nr. 1-4, S. 1 - 11Online Volltext: dx.doi.org/
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High quality silicon-on-insulator substrates by implanted oxygen ionsIn: Materials Science and Engineering B: Solid-State Materials for Advanced Technology Jg. 4 (1989) Nr. 1-4, S. 429 - 433Online Volltext: dx.doi.org/
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MESFETs in thin silicon on SIMOXIn: Electronics Letters Jg. 25 (1989) Nr. 23, S. 1580 - 1581Online Volltext: dx.doi.org/
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On the design of a JFET-CMOS front-end for low-noise data acquisition from microstrip detectorsIn: Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment Jg. 264 (1988) Nr. 2-3, S. 391 - 398Online Volltext: dx.doi.org/
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A technology concept for integrated detector electronics with CMOS-compatible devicesIn: Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment Jg. 253 (1987) Nr. 3, S. 434 - 438Online Volltext: dx.doi.org/
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Characterization of buried silicon-nitride formed by nitrogen implantation
Ion Beam Modification of Materials ; Fifth International Conference on Ion Beam Modification of Materials ; 9 - 13 June 1986, Catania, Italy,In: Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms Jg. 19-20 (1987) Nr. Part 1, S. 279 - 284Online Volltext: dx.doi.org/ -
Anwendung des Lasers zur Herstellung neuer Strukturen für die MikroelektronikIn: Laser und Optoelektronik Jg. 18 (1986) Nr. 1, S. 49 - 54
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CMOS on buried nitride : A VLSI SOI technologyIn: IEEE Transactions on Electron Devices (T-ED) Jg. 30 (1983) Nr. 11, S. 1515 - 1520Online Volltext: dx.doi.org/
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Performance of buried nitride CMOS devicesIn: IEEE Transactions on Electron Devices (T-ED) Jg. 30 (1983) Nr. 11, S. 1606 - 1607Online Volltext: dx.doi.org/
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DICMOS - novel MOS logicIn: Electronics Letters Jg. 18 (1982) Nr. 21, S. 930 - 932Online Volltext: dx.doi.org/
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Performance of a scaled Si gate n-well CMOS technologyIn: Electronics Letters Jg. 17 (1981) Nr. 18, S. 666 - 667Online Volltext: dx.doi.org/
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3D applicable ALD film for humidity detectionIn: SmartSystems Integration: 13th International Conference & Exhibition on Integration Issues of Miniaturized Systems ; Barcelona, Spain, 10 – 11 April 2019 / Smartsystems Integration (SSI) ; International Conference and Exhibition on Integration Issues of Miniaturized Systems ; 10 - 11 April 2019, Barcelona, Spain / Otto, Thomas (Hrsg.) (2019) S. 309 - 312
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Diamond like carbon as a hydrophobic material for electrowettingIn: 3rd YRA MedTech Symposium 2019: Symposium Proceedings / 3rd YRA MedTech Symposium, May 24 2019, FH Aachen, Campus Jülich, Germany / Staat, Manfred; Erni, Daniel (Hrsg.) (2019) S. 47 - 48(Open Access)
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Herstellung nano-skalierter Gassensoren unter Verwendung neuer Metalloxid-ALD-PrecursormaterialienIn: MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration – Säulen der Digitalisierung und künstlichen Intelligenz / MikroSystemTechnik Kongress ; 28. – 30. Oktober 2019, Berlin (2019) S. 514 - 517
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Mikrostrukturierung für super-hydrophobe Oberflächen in ElectrowettingIn: MikroSystemTechnik Kongress 2019: Mikroelektronik | MEMS-MOEMS | Systemintegration – Säulen der Digitalisierung und künstlichen Intelligenz / MikroSystemTechnik Kongress ; 28. – 30. Oktober 2019, Berlin (2019) S. 762 - 765
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Development of micro electromechanical biosensor for fast detection of respiratory syncytial virus infections in newborns
BMTMedPhys 2017 ; Annual Meeting of the German Society of Biomedical Engineering and Joint Conference in Medical Physics ; 10–13 September 2017, Dresden, Germany,In: Biomedical engineering = Biomedizinische Technik Jg. 62 (2017) Nr. s1, S. S144Online Volltext: dx.doi.org/ (Open Access) -
CMOS integrated biosensor for the detection of biomarkers
BMT 2014 ; 48. DGBMT Jahrestagung ; October 8-10, 2014, Hannover, Germany,In: Biomedical engineering = Biomedizinische Technik Jg. 59 (2014) Nr. s1, S. S120Online Volltext: dx.doi.org/ -
Development of a microchip based cell sorting device
BMT 2014 ; 48. DGBMT Jahrestagung ; October 8-10, 2014, Hannover, Germany,In: Biomedical engineering = Biomedizinische Technik Jg. 59 (2014) Nr. s1, S. S121 - S123Online Volltext: dx.doi.org/ (Open Access) -
Microelectromechanical implants: encapsulation concepts and test procedures
BMT 2012 ; 46. DGBMT Jahrestagung ; Track D, Biomaterials and Biocompatibility ; 16. bis 19. September 2012, Jena,In: Biomedical engineering = Biomedizinische Technik Jg. 57 (2012) Nr. s1, S. 914Online Volltext: dx.doi.org/ -
A new approach for detecting ionophore concentrations in tethered bilayer lipid membranes
BMT 2011 ; 45. Jahrestagung der DGBMT ; 27. - 30. September 2011, Freiburg, Germany,In: Biomedical engineering = Biomedizinische Technik Jg. 56 (2011) Nr. s1, P96Online Volltext: dx.doi.org/ -
Indium-Tin-Oxide (ITO) layer integration in single-polysilicon standard CMOS processes to improve the CTE in photogate pixelsIn: Proceedings of the EOS Conferences at the World of Photonics Congress 2009: ICM, International Congress Centre Munich, Germany ; digest CD-ROM contents: frontiers in electronic imaging, 15 to 16 June 2009 [and] manufacturing of optical components, 15 to 17 June 2009 / EOS Conference on Frontiers in Electronic Imaging ; EOS Conference on Manufacturing of Optical Components ; World of Photonics Congress ; 15 to 17 June, 2009, Munich, Germany (2009)
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Monocrystalline diode bolometer made by low temperature direct wafer bondingIn: WaferBond '09: Book of abstracts / Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration (WaferBond) ; 06.-08.12.2009, Grenoble, France (2009) S. 83 - 84
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Simulation des Laserabgleichs von Dünnfilmwiderständen mit Widerstandsnetzwerk im SchaltungssimulatorIn: MikroSystemTechnik-Kongress 2009: 12. - 14. Oktober 2009, Berlin ; Proceedings / MikroSystemTechnik-Kongress ; 12. - 14. Oktober 2009, Berlin (2009) S. .
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Positive charge trapping induced by plasma charging damage in NMOS transistorsIn: 38th European Solid-State Device Research Conference (ESSDERC) and 34th European Solid State Circuits Conference (ESSCIRC): [incl. Fringe Poster Session] / European Solid-State Device Research Conference (ESSDERC) ; 34th European Solid State Circuits Conference (ESSCIRC) ; 15 - 19 September 2008, Edinburgh, Scotland, UK (2008) P28
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Integrated flow sensor with monocrystalline silicon membrane operating in Thermal Time-of-Flight modeIn: Eurosensors XVI: The 16th European Conference on Solid-State Transducers, September 15 - 18, 2002, Prague, Czech Republic ; Book of Abstracts ; Pt. 2:Tuesday / European Conference on Solid-State Transducers ; Eurosensors ; September 15 - 18, 2002, Prague, Czech Republic / Saneistr, Jiri; Ripka, Pavel (Hrsg.) (2002) S. 403 - 404
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Investigations on silicon thermal flow sensors with mesa structuresIn: Eurosensors XVI: The 16th European Conference on Solid-State Transducers, September 15 - 18, 2002, Prague, Czech Republic ; Book of Abstracts ; Pt. 2:Tuesday / European Conference on Solid-State Transducers ; Eurosensors ; September 15 - 18, 2002, Prague, Czech Republic / Saneistr, Jiri; Ripka, Pavel (Hrsg.) (2002) S. 405 - 406
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Investigation of the properties of a single-chip potentiostat supporting three electrode cells for its operation with voltammetric and AC modesIn: 3rd International Symposium on Electrochemical Microsystem Technologies: Program and abstracts / International Symposium on Electrochemical Microsystem Technologies ; 10.-15.09.2000, Garmisch-Partenkirchen, Germany (2000) S. 41
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On the determination of standard rate constants using ultra-microelectrode arrays and electrochemical impedance spectroscopy at low frequenciesIn: Electroanalysis: abstracts of the 8th international conference held from 11 to 15 June 2000 at the University of Bonn, Germany / International Conference on ElectroAnalysis (ESEAC) ; 11 to 15 June 2000, Bonn, Germany / Emons, Hendrik; Ostapczuk, Peter (Hrsg.) (2000) B 03
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Quality control of ultra-microelectrode arrays using cyclic voltammetry, electrochemical impedance spectroscopy and scanning electrochemical microscopyIn: 8th International Meeting on Chemical Sensors (IMCS-8): Abstract book / International Meeting on Chemical Sensors (IMCS) ; 2 - 5 July 2000, Basel, Switzerland (2000) S. 174
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Reduction of heat loss of silicon membranes by the use of trench etching techniquesIn: Abstracts: Eurosensors VII / Eurosensors ; 26 - 29 September 1993, Budapest (1993) S. 348
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SIMOX and wafer bonding, combination of competitors complements one anotherIn: Extended abstracts: 183rd Electrochemical Society Meeting ; Spring meeting ; Honolulu, Hawaii, USA, 16.-21.05. 1993 / Spring Meeting of the Electrochemical Society ; 16.-21.05. 1993, Honolulu, Hawaii, USA (1993) S. 1246 - 1247
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A miniature single chip pressure and temperature sensorIn: MME '92: Micromechanics Europe 1992 ; 3rd Workshop on Micromachining, Micromechanics and Microsystems ; June 1 - 2, 1992, Leuven, Belgium ; Workshop digest / Workshop on Micromachining, Micromechanics and Microsystems (MME) ; Micromechanics Europe ; June 1 - 2, 1992, Leuven, Belgium (1992) S. 183 - 186
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An intelligent 500 V power vertical DMOS on SIMOX substrateIn: Extended abstracts: 181st Society Meeting / Meeting of the Electrochemical Society ; May 17 - 22, 1992, St. Louis, Mo., USA (1992) S. 265 - 266
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SIMOX, an efficient etch-stop to fabricate silicon membranes with well defined thicknessIn: Extended abstracts: 181st Society Meeting / Meeting of the Electrochemical Society ; May 17 - 22, 1992, St. Louis, Mo., USA (1992) S. 321 - 322
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Minimum oxygen dose for reliable application of SIMOXIn: International Conference on Advanced Materials (ICAM 91): Final book of abstracts (1991) S. D - IV2
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Characterization of CMOS devices and circuits build on SIMOX substratesIn: Extended abstracts: 177th Society Meeting ; Spring meeting ; Montreal, Quebec, Canada, 06.-11.05.1990 / Spring Meeting of the Electrochemical Society ; 06.-11.05.1990, Montreal, Quebec, Canada (1990) S. 504
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Buried silicon nitride formed by nitrogen implantationIn: Extended Abstracts: 169th Society Meeting ; Vol. 1 / Meeting of the Electrochemical Society ; May 04 - 09, 1986, Boston, Mass., USA (1986) S. 110
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Optimization of contacts for CMOSIn: ESSDERC '86, University of Cambridge, 8 - 11 September 1986: [16th European Solid State Device Research Conference] / European Solid State Device Research Conference (ESSDERC) ; 8 - 11 September 1986, Cambridge, UK / Moore, D. F. (Hrsg.) (1986) S. 170 - 171
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Technology for VLSI devices on ion implanted buried silicon nitrideIn: SOI Technology and 3D integration: Extended Abstracts of the 2nd International Workshop on Future Electron Devices / International Workshop on Future Electron Devices ; FED SOI/3D Workshop ; March 19 - 21, 1985 Shuzenji, Japan (1985) S. 111 - 115
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A high-performance scaled Si gate CMOS technologyIn: 11th European Solid State Device Research Conference: ESSDERC 81 ; Toulouse, France, September 14th - 17th, 1981 ; Symposium on Solid State Device Technology, SSSDT 81 / European Solid State Device Research Conference (ESSDERC) ; Symposium on Solid State Device Technology (SSSDT) ; September 14th - 17th, 1981, Toulouse, France (1981) S. 87 - 88
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Development of a 3D-integrated thermocatalytic sensor for combustible gas detectionIn: SMSI 2020: Sensor and Measurement Science International ; proceedings / Sensor and Measurement Science International (SMSI) ; 22.-25. Juni 2020, Nürnberg (abgesagt) 2020, S. 77 - 78Online Volltext: dx.doi.org/
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Development of a scalable nanotube-microbolometer technologyIn: SMSI 2020: Sensor and Measurement Science International ; proceedings / Sensor and Measurement Science International (SMSI) ; 22.-25. Juni 2020, Nürnberg (abgesagt) 2020, S. 165 - 166Online Volltext: dx.doi.org/
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Measurement concept to reduce environmental impact in direct time-of-flight LiDAR sensorsIn: Proceedings of the Quantum Sensing and Nano Electronics and Photonics XVII 2020 / Quantum Sensing and Nano Electronics and Photonics Conference ; 2 - 6 February 2020, San Francisco, Calif., USA 2020 1128809Online Volltext: dx.doi.org/
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Scalable nanotube-microbolometer technology with pixel pitches from 12 down to 6 µmIn: Electro-Optical and Infrared Systems: Technology and Applications XVII : 21-25 September 2020, online only, United Kingdom / Electro-Optical and Infrared Systems: Technology and Applications, 21.-25.09.2020, online only, United Kingdom / Hickman, Duncan L.; Bürsing, Helge (Hrsg.) 2020 1153704Online Volltext: dx.doi.org/
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Characterization of the Charge Transfer in an Enhanced Pinned Photodiode with a Collection GateIn: Optics, Photonics and Laser Technology 2017 / International Conference on Photonics, Optics and Laser Technology (PHOTOPTICS) ; 27 February to 1 March 2017, Porto, Portugal / Ribeiro, Paulo; Andrews, David L.; Raposo, Maria (Hrsg.) 2019, S. 193 - 212Online Volltext: dx.doi.org/
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Fabrication of Partly Encapsulated Vertical Nanoelectrodes for an Intracellular Microelectrode ArrayIn: 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (Transducers & Eurosensors XXXIII) / International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) ; Eurosensors ; 23.-27.06.2019, Berlin, Germany 2019, S. 1619 - 1622Online Volltext: dx.doi.org/
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Hermetical sealing of pressure sensor diaphragms by CVD of Si1-XGeX with minimized cavity depositionIn: Smartsystems integration: 13th International Conference & Exhibition on Integration Issues of Miniaturized Systems ; Barcelona, Spain, 10 – 11 April 2019 / Smartsystems Integration (SSI) ; International Conference and Exhibition on Integration Issues of Miniaturized Systems ; 10 - 11 April 2019, Barcelona, Spain / Otto, Thomas (Hrsg.) 2019, S. 234 - 241
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Hermeticity of SI₁₋XGEX Diaphragms for the Fabrication of a Capacitive Post-CMOS Pressure SensorIn: 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (Transducers & Eurosensors XXXIII) / International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) ; Eurosensors ; 23.-27.06.2019, Berlin, Germany 2019, S. 1862 - 1865Online Volltext: dx.doi.org/
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Measurement concept for direct time-of-flight sensors at high ambient lightIn: Quantum Sensing and Nano Electronics and Photonics XVI / Quantum Sensing and Nano Electronics and Photonics Conference, 2.-7. February 2019, San Francisco, California, USA / Razeghi, Manijeh (Hrsg.) 2019 109260WOnline Volltext: dx.doi.org/
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Mechanical Test Structures for the Determination of Normal Stress in Multilayer Freestanding MEMS-MembranesIn: PRIME 19: 15th Conference on Ph.D Research in Microelectronics and Electronics (PRIME 2019) ; conference proceedings) / Conference on Ph.D Research in Microelectronics and Electronics (PRIME), 15-18 July 2019, Lausanne, Switzerland 2019, S. 301 - 304Online Volltext: dx.doi.org/
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Post-CMOS 3D-Integration of a NanopellistorIn: PRIME 19: 15th Conference on Ph.D Research in Microelectronics and Electronics (PRIME 2019) ; conference proceedings) / Conference on Ph.D Research in Microelectronics and Electronics (PRIME), 15-18 July 2019, Lausanne, Switzerland 2019, S. 109 - 112Online Volltext: dx.doi.org/
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Wafer-Level-3D-Integrationsverfahren für hochsensitive optische SensorenIn: 20. GMA/ITG-Fachtagung Sensoren und Messsysteme 2019: NürnbergConvention Center, 25. und 26. Juni 2019 / GMA/ITG-Fachtagung Sensoren und Messsysteme, 25.-26.06.2019, Nürnberg 2019, S. 236 - 242Online Volltext: dx.doi.org/ (Open Access)
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Analysis and simulation of super-hydrophobic layers for microfluidic applicationsIn: Mikro-Nano-Integration: Beiträge des 7. GMM-Workshops / GMM-Workshop Mikro-Nano-Integration ; 22.-23. Oktober 2018, Dortmund, Germany / Hoffmann, Martin (Hrsg.) 2018, S. 33 - 37
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Decreasing the Actuation Voltage in Electrowetting on Dielectric with Thin and Micro-Structured DielectricIn: 2018 PRIME: 14th Conference on PhD Research in Microelectronics and Electronics ; July 2nd-July 5th, 2018, Prague, Czech Republic / Conference on Ph.D. Research in Microelectronics and Electronics (PRIME) ; July 2nd-July 5th, 2018, Prague, Czech Republic / Gola, Alberto (Hrsg.) 2018, S. 205 - 208Online Volltext: dx.doi.org/
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Development of a Piezoelectric Flexural Plate-Wave (FPW) Biomems-Sensor for Rapid Point-of-Care DiagnosticsIn: Nanostructured Materials for the Detection of CBRN / NATO Advanced Research Workshop on Nanostructured Materials for the Detection of CBRN ; 14–17 August 2017, Kiev, Ukraine / Bonča, Janez; Kruchinin, Sergei (Hrsg.) 2018, S. 199 - 212Online Volltext: dx.doi.org/
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Die-level patterning of parylene F by Laser-Ablation for further Processing with ALD functional layersIn: Smart Systems Integration: International Conference and Exhibition on Integration Issues of Miniaturized Systems, Dresden, Germany 11-12 April 2018 / Smart Systems Integration ; 12th International Conference and Exhibition on Integration Issues of Miniaturized Systems ; 11 - 12 April 2018, Dresden, Germany / Otto, Thomas (Hrsg.) 2018, S. 392 - 395
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Digital uncooled IRFPAs based on microbolometers with 17 μm and 12 μm pixel pitchIn: Electro-Optical and Infrared Systems: Technology and Applications XV / Electro-Optical and Infrared Systems: Technology and Applications, 12-13 September 2018, Berlin, Germany / Huckridge, David; Bürsing, Helge; Hickman, Duncan L. (Hrsg.) 2018 1079504Online Volltext: dx.doi.org/
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Evaluation of a median threshold based EEPROM-PUF concept implemented in a high temperature SOI CMOS technologyIn: 2018 13th IEEE International Conference on Design & Technology of Integrated Systems in Nanoscale Era (DTIS): proceedings ; April 10th-12th, 2018, Taormina, Italy / IEEE International Conference on Design & Technology of Integrated Systems in Nanoscale Era (DTIS) ; April 10th-12th, 2018, Taormina, Italy 2018 8368576Online Volltext: dx.doi.org/
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High-performance uncooled digital 17 μm QVGA-IRFPA-using microbolometer based on amorphous silicon with massively parallel Sigma-Delta-ADC readoutIn: Infrared Technology and Applications XLIV 2018: 16-19 April 2018, Orlando, Florida, United States / Infrared Technology and Applications ; 16 - 19 April 2018, Orlando, Florida, USA / Andresen, Bjørn F.; Fulop, Gabor F.; Hanson, Charles M.; Miller, John Lester; Norton, Paul R. (Hrsg.) 2018 1062419Online Volltext: dx.doi.org/
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Multi object detection in direct Time-of-Flight measurements with SPADsIn: 2018 PRIME: 14th Conference on PhD Research in Microelectronics and Electronics ; July 2nd-July 5th, 2018, Prague, Czech Republic / Conference on Ph.D. Research in Microelectronics and Electronics (PRIME) ; July 2nd-July 5th, 2018, Prague, Czech Republic / Gola, Alberto (Hrsg.) 2018, S. 237 - 240Online Volltext: dx.doi.org/
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New concept for post-CMOS pellistor integrationIn: Mikro-Nano-Integration: Beiträge des 7. GMM-Workshops / GMM-Workshop Mikro-Nano-Integration, 22.-23. Oktober 2018, Dortmund, Germany / Hoffmann, Martin (Hrsg.) 2018, S. 28 - 32
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Penetrating nanoelectrodes for an electrical cell interface on CMOS ASICIn: Mikro-Nano-Integration: Beiträge des 7. GMM-Workshops / GMM-Workshop Mikro-Nano-Integration, 22.-23. Oktober 2018, Dortmund, Germany / Hoffmann, Martin (Hrsg.) 2018, S. 7 - 12
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Post-CMOS MEMS capacitive pressure sensor : Porous ALD membrane for sacrificial layer release and diaphragm sealingIn: Smart Systems Integration: International Conference and Exhibition on Integration Issues of Miniaturized Systems, Dresden, Germany, 11-12 April 2018 / Smart Systems Integration ; 12th International Conference and Exhibition on Integration Issues of Miniaturized Systems ; 11 - 12 April 2018, Dresden, Germany / Otto, Thomas (Hrsg.) 2018, S. 86 - 93
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Thin film ALD materials as functional layer for 3D-integrated metal oxide gas-sensorsIn: Mikro-Nano-Integration: Beiträge des 7. GMM-Workshops / GMM-Workshop Mikro-Nano-Integration, 22.-23. Oktober 2018, Dortmund, Germany / Hoffmann, Martin (Hrsg.) 2018, S. 68 - 73
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A side-wall spacer process for releasing and sealing of post-CMOS MEMS pressure sensor membranesIn: MEMS, Mikroelektronik, Systeme: MikroSystemTechnik 2017 ; congress ; 23.-25. Oct. 2017 / MikroSystemTechnik Kongress ; 23.-25. Oktober 2017, München / Kutter, Christoph (Hrsg.) 2017, S. 90 - 93
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Analysis of semiconductor process variations by means of hierarchical median polishIn: 2017 25th Austrian Workshop on Microelectronics: Austrochip 2017 ; 12 October 2017, Linz, Austria ; proceedings / Austrian Workshop on Microelectronics ; Austrochip ; 12 October 2017, Linz; Austria 2017, S. 1 - 5Online Volltext: dx.doi.org/
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Automating wafer-level test of uncooled infrared detectors using wafer-proberIn: 2017 IEEE 23rd International Symposium on On-Line Testing and Robust System Design (IOLTS): 3-5 July 2017, Hotel Makedonia Palace, Thessaloniki, Greece / International Symposium on On-Line Testing and Robust System Design (IOLTS) ; 03. - 05.07.2017, Thessaloniki, Greece 2017, S. 13 - 16Online Volltext: dx.doi.org/
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CMOS SiPM with integrated amplifierIn: Optical Components and Materials XIV / Optical Components and Materials ; 30 January - 1 February 2017, San Francisco, California, USA / Jiang, Shibin; Digonnet, Michel J. F. (Hrsg.) 2017 101001AOnline Volltext: dx.doi.org/
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Development of a patterning process for releasing and sealing of post-CMOS MEMS pressure sensor membranesIn: Smartsystems Integration: International Conference and Exhibition on the integration of materials, devices and systems ; Cork, Ireland, 8-9 March 2017 / Smart Systems Integration ; International Conference and Exhibition on the integration of materials, devices and systems ; 08. - 09.03.2017, Cork, Ireland / Otto, Thomas (Hrsg.) 2017, S. 306 - 313
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Elektro-optische Charakterisierung von Ferninfrarot-Bildaufnehmern mittels Bauelementetest in der SerienproduktionIn: MEMS, Mikroelektronik, Systeme: MikroSystemTechnik 2017 ; congress ; 23.-25. Oct. 2017 / MikroSystemTechnik Kongress 2017 ; 23.-25. Oktober 2017; München / Kutter, Christoph (Hrsg.) 2017, S. 468 - 471
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Implementation of an integrated differential readout circuit for transistor-based physically unclonable functionsIn: 2017 25th Austrian Workshop on Microelectronics: Austrochip 2017 ; 12 October 2017, Linz, Austria ; proceedings / 25th Austrian Workshop on Microelectronics ; Austrochip 2017 ; 12 October 2017, Linz, Austria 2017, S. 58 - 63Online Volltext: dx.doi.org/
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Optimization of transfer times in pinned photodiodesIn: PHOTOPTICS 2017: Proceedings of the 5th International Conference on Photonics, Optics and Laser Technology / International Conference on Photonics, Optics and Laser Technology ; PHOTOPTICS ; February 27-March 1, 2017, Porto, Portugal / Raposo, Maria; Andrews, David; Ribeiro, Paulo A. (Hrsg.) 2017, S. 312 - 316Online Volltext: dx.doi.org/
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Tapering of nanoelectrodes for an intracellular contact via a double hard mask techniqueIn: PRIME 2017: 13th Conference on Ph.D. Research in Microelectronics and Electronics ; conference proceedings ; 12th-15th June 2017, Giardini Naxos, Taormina, Italy / Conference on Ph.D. Research in Microelectronics and Electronics (PRIME) ; 12.-15.06.2017, Taormina, Italy / Pennisi, Salvatore (Hrsg.) 2017, S. 305 - 308Online Volltext: dx.doi.org/
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Untersuchung von dreidimensionalen Nanoelektroden für die intrazelluläre Kontaktierung auf integrierten SchaltungenIn: MEMS, Mikroelektronik, Systeme: MikroSystemTechnik 2017 ; congress ; 23.-25. Oct. 2017 / MikroSystemTechnik Kongress 2017 ; 23.-25. Oktober 2017; München / Kutter, Christoph (Hrsg.) 2017, S. 540 - 543
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ALD-based 3D-capacitors for harsh environmentsIn: 2016 12th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME) / Conference on Ph.D. Research in Microelectronics and Electronics (PRIME) ; 27-30 June 2016, Lisbon, Portugal 2016 7519480Online Volltext: dx.doi.org/
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Digital microfluidics for microchip-based cell sortingIn: Micro-Nano-Integration: 6. GMM-Workshop : 5-6 Oct. 2016 / GMM-Workshop Mikro-Nano-Integration ; 5. - 6. Oktober 2016, Duisburg 2016, S. 17 - 21
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Entwicklung eines piezoresistiven Drucksensors für Hochtemperaturanwendungen auf Basis eines SOI-SubstratsIn: Sensoren und Messsysteme 2016: 18. GMA/ITG-Fachtagung, Nürnberg Convention Center, 10. und 11. Mai 2016 ; Tagungsband / GMA/ITG-Fachtagung Sensoren und Messsysteme ; 10. und 11. Mai 2016, Nürnberg 2016, S. 28 - 35Online Volltext: dx.doi.org/
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Materials and technologies to enable high temperature stable MEMS and electronics for smart systems used in harsh environmentsIn: China Semiconductor Technology International Conference 2016 (CSTIC 2016) / China Semiconductor Technology International Conference (CSTIC) ; 13-14 March 2016, Shanghai, China / Claeys, Cor; Wu, Hanming; Lin, Qinghuang (Hrsg.) 2016 7463912Online Volltext: dx.doi.org/
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Measurement results of a 12 μm pixel size microbolometer array based on a novel thermally isolating structure using a 17 μm ROICIn: Infrared Technology and Applications XLII: 18-21 April 2016, Baltimore, Maryland, United States / Conference on Infrared Technology and Applications ; 18-21 April 2016, Baltimore, Maryland, USA / Andresen, Bjørn F.; Fulop, Gabor F.; Hanson, Charles M.; Norton, Paul R. (Hrsg.) 2016 98191NOnline Volltext: dx.doi.org/
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Nanostructures on CMOS-intelligent sensors and actuators by post processingIn: Micro-Nano-Integration: 6. GMM-Workshop ; 5-6 Oct. 2016 / GMM-Workshop Mikro-Nano-Integration ; 5. - 6. Oktober 2016, Duisburg 2016, S. 182 - 187
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Post-CMOS integrated ALD 3D micro- and nanostructures and application for multi-electrode arraysIn: Micro-Nano-Integration: 6. GMM-Workshop ; 5-6 Oct. 2016 / GMM-Workshop Mikro-Nano-Integration ; 5-6 Oct. 2016, Duisburg, Germany 2016, S. 115 - 118
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Post-CMOS integration of miniaturized solar cells for energy harvesting of autonomous sensor nodesIn: Micro-Nano-Integration: 6. GMM-Workshop ; 5-6 Oct. 2016 / GMM-Workshop Mikro-Nano-Integration ; 5. - 6. Oktober 2016, Duisburg 2016, S. 151 - 155
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Statistical tests to determine spatial correlations in the response behavior of PUFsIn: 2016 12th Conference on Ph.D. Research in Microelectronics and Electronics (PRIME) / Conference on Ph.D. Research in Microelectronics and Electronics (PRIME) ; 27-30 June 2016, Lisbon, Portugal 2016 7519475Online Volltext: dx.doi.org/
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Ungekühlte Mikrobolometer-Arrays basierend auf einer neuartigen thermisch isolierenden StrukturIn: Sensoren und Messsysteme 2016: 18. GMA/ITG-Fachtagung, Nürnberg Convention Center, 10. und 11. Mai 2016 ; Tagungsband / GMA/ITG-Fachtagung Sensoren und Messsysteme ; 10. und 11. Mai 2016, Nürnberg 2016, S. 242 - 248Online Volltext: dx.doi.org/
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ALD-basierte, monolithisch integrierte 3D-NanostrukturenIn: MEMS, Mikroelemente, Systeme: MikroSystemTechnik Kongress 2015 ; 26. - 28. Oktober 2015 in Karlsruhe ; proceedings / MikroSystemTechnik Kongress ; 26. - 28. Oktober 2015, Karlsruhe / Saile, Volker (Hrsg.) 2015, S. 405 - 408
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Beschleunigte Zuverlässigkeitsuntersuchung von Siliziumnitrid bei schmalbandiger UV-BestrahlungIn: MEMS, Mikroelemente, Systeme: MikroSystemTechnik Kongress 2015 ; 26. - 28. Oktober 2015 in Karlsruhe ; proceedings / MikroSystemTechnik Kongress ; 26. - 28. Oktober 2015, Karlsruhe / Saile, Volker (Hrsg.) 2015, S. 753 - 756
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CMOS integrated miniaturized photovoltaic cells for autonomous sensor nodes: simulations and experimental resultsIn: SENSOR 2015: 17th International Conference on Sensors and Measurement Technology ; IRS² 2015 ; 14th International Conference on Infrared Sensors & Systems ; AMA conferences 2015 / International Conference on Sensors and Measurement Technology (SENSOR) ; 19. - 21.5.2015, Nuremberg, Germany 2015, S. 635 - 640Online Volltext: dx.doi.org/
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Charakterisierung und Modellierung freistehender Silizium Membranen auf SOI-Basis für Drucksensor-AnwendungenIn: MEMS, Mikroelemente, Systeme: MikroSystemTechnik Kongress 2015 ; 26. - 28. Oktober 2015 in Karlsruhe ; proceedings / MikroSystemTechnik Kongress ; 26. - 28. Oktober 2015, Karlsruhe / Saile, Volker (Hrsg.) 2015, S. 610 - 613
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Entwicklung einer Mikrochip navigierten ZellsortieranlageIn: MEMS, Mikroelemente, Systeme: MikroSystemTechnik Kongress 2015 ; 26. - 28. Oktober 2015 in Karlsruhe ; proceedings / MikroSystemTechnik Kongress ; 26. - 28. Oktober 2015, Karlsruhe / Saile, Volker (Hrsg.) 2015, S. 463 - 466
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Entwicklung von Hochtemperatur Trench-Kondensatoren unter Verwendung von dünnen ALD-DielektrikaIn: MEMS, Mikroelemente, Systeme: MikroSystemTechnik Kongress 2015 ; 26. - 28. Oktober 2015 in Karlsruhe ; proceedings / MikroSystemTechnik Kongress ; 26. - 28. Oktober 2015, Karlsruhe / Saile, Volker (Hrsg.) 2015, S. 425 - 428
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Investigation of diaphragm deflection of an absolute MEMS capacitive polysilicon pressure sensorIn: Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems: Barcelona, Spain ; 4 - 6 May 2015, Barcelona, Spain ; [part of SPIE microtechnologies] / Conference on Smart Sensors, Actuators, and MEMS; and Cyber Physical Systems ; 4 - 6 May 2015, Barcelona, Spain / Sánchez-Rojas, José Luis; Brama, Riccardo (Hrsg.) 2015 95170TOnline Volltext: dx.doi.org/
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Modeling of CMOS image sensors for time-of-flight applicationsIn: Optical Sensors 2015: 13 - 16 April 2015, Prague, Czech Republic ; [part of SPIE optics + optoelectronics] / Optical Sensors ; 13-16 April 2015, Prague, Czech Republic / Baldini, Francesco; Homola, Jiri; Lieberman, Robert A. (Hrsg.) 2015 950603Online Volltext: dx.doi.org/
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Thin-film SOI PIN-diode leakage current dependence on back-gate-potential and HCI trapsIn: ESSCIRC/ESSDERC 2015: proceedings of the 45th European Solid-State Device Research Conference ; Messe Congress, Graz, Austria, September 14-18, 2015 / European Solid-State Device Research Conference (ESSDERC) ; September 14-18, 2015, Graz, Austria / Pribyl, Wolfgang; Grasser, Tibor; Schrems, Martin (Hrsg.) 2015, S. 290 - 293Online Volltext: dx.doi.org/
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Uncooled digital QVGA-IRFPA with 17 µm pixel-pitch based on amorphous silicon with massively Sigma-Delta-ADC readoutIn: 42th Freiburg Infrared Colloquium / Freiburg Infrared Colloquium ; 03. - 04.03.2015, Freiburg, Germany 2015, S. 39 - 40
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Performance analysis of a large photoactive area CMOS line sensor for fast, time-resolved spectroscopy applicationsIn: Optical sensing and detection III / Optical Sensing and Detection III ; 14-17 April 2014, Brussels / Berghmans, Francis (Hrsg.) 2014 914103Online Volltext: dx.doi.org/
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Uncooled digital IRFPA-family with 17µm pixel-pitch based on amorphous silicon with massively parallel Sigma-Delta-ADC readoutIn: Infrared technology and applications XL / Conference on Infrared Technology and Applications ; 5 - 8 May 2014, Baltimore, Maryland, USA / Andresen, Bjørn F. (Hrsg.) 2014 90701MOnline Volltext: dx.doi.org/
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CMOS integrated free standing circular membrane for the detection of allergens and biomarkersIn: Von Bauelementen zu Systemen: Proceedings / Mikrosystemtechnik Kongress 2013, 14. - 16. Oktober 2013 in Aachen 2013, S. 822 - 825
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CMOS kompatible, nanomodifizierte Multi-Elektroden-ArraysIn: Von Bauelementen zu Systemen: Proceedings / Mikrosystemtechnik Kongress 2013, 14. - 16. Oktober 2013, Aachen / Mokwa, Wilfried (Hrsg.) 2013, S. 592 - 595
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Development of an universial allergen sensor systemIn: AMA conferences 2013 proceedings: Nürnberg Exhibition Centre, Germany, 14. - 16.5.2013 ; with SENSOR, OPTO, IRS 2 / Sensor 2013 ; 14. - 16.05.2013, Nürnberg, Germany 2013, S. 540 - 545Online Volltext: dx.doi.org/
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Entwicklung eines hochtemperaturfesten Kondensators für die MikrosystemtechnikIn: Von Bauelementen zu Systemen: Proceedings / Mikrosystemtechnik Kongress 2013, 14. - 16. Oktober 2013 in Aachen 2013, S. 834 - 836
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Far infrared digital IRFPA based on uncooled microbolometer for automotive and military applicationsIn: 41th Freiburg Infrared Colloquium / Freiburg Infrared Colloquium ; 26. - 27.02.2013, Freiburg, Germany 2013, S. 51 - 52
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Flip-Chip Technologie für Anwendungstemperaturen > 250 °CIn: Von Bauelementen zu Systemen: Proceedings / Mikrosystemtechnik Kongress 2013, 14. - 16. Oktober 2013, Aachen / Mokwa, Wilfried (Hrsg.) 2013, S. 709 - 712
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Speed considerations for LDPD based time-of-flight CMOS 3D image sensorsIn: ESSCIRC 2013: Proceedings of the 39th European Solid‐State Circuits Conference / European Solid‐State Circuits Conference (ESSCIRC) ; 16 - 20 September 2013, Bucharest, Romania / Rusu, Ştefan (Hrsg.) 2013, S. 299 - 302Online Volltext: dx.doi.org/
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Verkapselungstechniken für implantierbare integrierte MEMS DrucksensorenIn: Von Bauelementen zu Systemen: Proceedings / Mikrosystemtechnik Kongress 2013, 14. - 16. Oktober 2013, Aachen / Mokwa, Wilfried (Hrsg.) 2013, S. 586 - 587
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Adaptive readout circuit for pinned and lateral drift-field photo diodesIn: PRIME 2012 / 8th Conference on Ph.D. Research in Microelectronics & Electronics, 12 - 15 Juni 2012, Aachen, Germany / Heinen, Stefan (Hrsg.) 2012, S. 333 - 336
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Direct integration of carbon nanotubes on CMOS with high-temperature tungsten metallizationIn: Mikro-Nano-Integration: Beiträge des 4. GMM-Workshops, 12. - 13. November 2012 in Berlin / GMM-Workshop ; 12. - 13. November 2012, Berlin / Hoffmann, Martin (Hrsg.) 2012
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Excimer laser annealing of amorphous silicon-germanium layers for above IC processingIn: PRIME 2012 / 8th Conference on Ph.D. Research in Microelectronics & Electronics (PRIME), 12 - 15 Juni 2012, Aachen, Germany / Heinen, Stefan (Hrsg.) 2012, S. 267 - 270
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Process window of thermosonic palladium wire bonding on electroplated gold layers for high temperature applicationsIn: MiNaPAD Forum 2012: Proceedings / 2nd Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing (MiNaPAD) Forum ; 25.-26.04.2012, Grenoble, France 2012
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Reliability of thermosonic bonded palladium wires in high temperature environments up to 350 °CIn: 23rd Micromechanics and Microsystems Europe Workshop: Proceedings / Micromechanics and Microsystems Europe (MME) Workshop ; September 9 - 12, 2012, Ilmenau, Germany / Scharff, Peter; Schneider, Andrea (Hrsg.) 2012 C 01
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Sacrificial ion beam etching process for seed layer removal of 6 µm pitch CuSn micro bumpsIn: E-MRS spring meeting 2012, Symposium M: More than Moore ; Novel Materials Approaches for Functionalized Silicon Based Microelectronics ; Strasbourg, France, 14 - 18 May 2012 / E-MRS 2012 Spring Meeting, Symposium M ; 14.-18.05.2012, Strasbourg, France 2012 012005Online Volltext: dx.doi.org/ (Open Access)
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Thermal Imagers based on uncooled microbolometersIn: CMOS Imaging: Extending the dimensions / 6th Fraunhofer IMS Workshop ; 12.-13.06.2011, Duisburg, Germany 2012 [34 Bl.]
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A far infrared VGA detector based on uncooled microbolometers for automotive applicationsIn: Advanced Microsystems for Automotive Applications 2011: Smart Systems for Electric, Safe and Networked Mobility / 15th International Forum on Advanced Microsystems for Automotive Applications (AMAA) ; 29 - 30 June 2011, Berlin, Germany / Meyer, Gereon; Valldorf, Jürgen (Hrsg.) 2011, S. 327 - 334Online Volltext: dx.doi.org/
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A novel mass sensitive sensorIn: Mikrosystemtechnik Kongress 2011: Proceedings / Mikrosystemtechnik Kongress ; 10. - 12. Oktober 2011, Darmstadt / Schlaak, Helmut F. (Hrsg.) 2011, S. 54 - 57
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Bestimmung der NETD von Fern-Infrarot Imagern auf Wafer-Level unter Umgebungsdruck in der SerienproduktionIn: Mikrosystemtechnik Kongress 2011: Proceedings / Mikrosystemtechnik Kongress ; 10. - 12. Oktober 2011, Darmstadt / Schlaak, Helmut F. (Hrsg.) 2011, S. 165 - 168
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CMOS photodiodes for narrow linewidth applicationsIn: IEEE Sensors, 2011: 28 - 31 Oct. 2011, Limerick, Ireland ; proceedings ; the Tenth IEEE Sensors Conference 2011 ; Vol. 3 / IEEE SENSORS ; 28 - 31 October 2011, Limerick, Ireland 2011, S. 1600 - 1603Online Volltext: dx.doi.org/
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Development of an uncooled 25µm pixel-pitch VGA-IRFPAIn: 40th Freiburg Infrared Colloquium / Freiburg Infrared Colloquium ; 16.-17.02.2011, Freiburg, Germany 2011 Paper 5.2
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Excimer laser-annealing of amorphous silicon layersIn: COMSOL Conference, Stuttgart 2011: proceedings / COMSOL Conference, Stuttgart, 26.-28.10.2011 2011
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Improvements of a digital 25µm pixel-pitch uncooled amorphous silicon TEC-less VGA IRFPA with massively parallel Sigma-Delta-ADC readoutIn: Infrared technology and applications XXXVII: 25 - 29 April 2011, Orlando, Florida, United States ; Pt. 1 / 37th Conference on Infrared Technology and Applications ; 25 - 29 April 2011, Orlando, Florida, USA / Andresen, Bjørn F.; Fulop, Gabor F.; Norton, Paul R. (Hrsg.) 2011 80121FOnline Volltext: dx.doi.org/
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Multiphysics simulations for the optimisation of CMOS processes for high precision optical measurement applicationsIn: Multiphysics simulations - advanced methods for industrial engineering: Selected contributions from 1st Fraunhofer Multiphysics Conference / Fraunhofer Multiphysics Conference, 22.-23.06.2010, Bonn, Germany 2011, S. 239 - 249
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Simulation method for LWIR radiation distribution using a visual ray-tracerIn: Proceedings of the International Conference on Numerical Simulation of Optoelectronic Devices: NUSOD 2011; 5 - 8 Sept. 2011, Rome, Italy / International Conference on Numerical Simulation of Optoelectronic Devices (NUSOD) ; 5 - 8 Sept. 2011, Rome, Italy / Piprek, Joachim (Hrsg.) 2011, S. 57 - 58Online Volltext: dx.doi.org/
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Telemetrisches Drucksensorsystem zur kontinuierlichen Blutdruckmessung im HerzenIn: Tagungsband: Kongress für Technologien in der Medizin und Energieeffizienz in Kliniken, Wümek ; Würzburg, 23. - 25. Mai 2011 / Kongress für Technologien in der Medizin und Energieeffizienz in Kliniken (Wümek) ; 23. - 25. Mai 2011, Würzburg / Nippa, Jürgen (Hrsg.) 2011, S. 53 - 60
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A digital 25 µm pixel-pitch uncooled amorphous silicon TEC-less VGA IRFPA with massive parallel Sigma-Delta-ADC readoutIn: Infrared technology and applications XXXVI: 5 - 9 April 2010, Orlando, Florida, United States / 36th Conference on Infrared Technology and Applications ; 5 - 9 April 2010, Orlando, Florida, USA / Andresen, Bjørn F.; Fulop, Gabor F.; Norton, Paul R. (Hrsg.) 2010 76600SOnline Volltext: dx.doi.org/
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A new DC-temperature model for a diode bolometer based on SOI-pin-diode test structuresIn: XIth International Workshop on Symbolic and Numerical Methods, Modeling and Applications to Circuit Design (SM2ACD) / International Workshop on Symbolic and Numerical Methods, Modeling and Applications to Circuit Design (SM2ACD) ; 4-6 Oct. 2010, Gammarth, Tunisia 2010 5672328Online Volltext: dx.doi.org/
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CMOS process enhancement for high precision narrow linewidth applicationsIn: Proceedings of the European Solid-State Device Research Conference (ESSDERC), 2010 / 40th European Solid-State Device Research Conference (ESSDERC) ; 14 - 16 September 2010, Sevilla, Spain 2010, S. 254 - 256Online Volltext: dx.doi.org/
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Devices and technologies for CMOS imagingIn: 5th Fraunhofer IMS Workshop CMOS Imaging / Fraunhofer IMS Workshop CMOS Imaging ; 12.-13.06.2011, Duisburg, Germany 2010 [32 Bl.]
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Fabrication method for chip-scale-vacuum-packages based on a chip-to-wafer-processIn: Electro-optical and infrared systems: technology and applications VII: 21 - 23 September 2010, Toulouse, France / Electro-Optical and Infrared Systems: Technology and Applications Conference ; 21 - 23 September 2010, Toulouse, France / Huckridge, David A.; Ebert, Reinhard R. (Hrsg.) 2010 78340SOnline Volltext: dx.doi.org/
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Investigation of the temperature coefficient of electrical resistance and 1/f noise of laser-annealed amorphous silicon layersIn: 18th International Conference on Advanced Thermal Processing of Semiconductors (RTP) 2010 / International Conference on Advanced Thermal Processing of Semiconductors (RTP) ; September 18, 2010 - October 1, 2010, Gainesville, Florida, USA / Lojek, Bo (Hrsg.) 2010, S. 104 - 109Online Volltext: dx.doi.org/
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A fast WLR test for the evaluation of EEPROM enduranceIn: IEEE International Integrated Reliability Workshop final report, 2009: Stanford Sierra Conference Center, S. Lake Tahoe, California, October 18-22, 2009 / IEEE International Integrated Reliability Workshop (IRW) ; October 18-22, 2009, S. Lake Tahoe, California, USA 2009, S. 20 - 24Online Volltext: dx.doi.org/
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CMOS Post-Processing für kompakte, intelligente MikrosystemeIn: MikroSystemTechnik-Kongress 2009: 12. - 14. Oktober 2009, Berlin ; Proceedings / MikroSystemTechnik-Kongress ; 12. - 14. Oktober 2009, Berlin 2009 Paper 19
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In-vitro tests for biostability of materials for micro implantsIn: MME 2009: 20th Micromechanics Europe Workshop : 20 - 22 September 2009, Toulouse, France / Micromechanics Europe Workshop (MME) ; 20 - 22 September 2009, Toulouse, France 2009 D 27.1-3
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Light switched plasma charging damage protection device allowing high field characterizationIn: ESSDERC 2009: Proceedings of the 39th European Solid-State Device Research Conference ; [Co-located with the 35th European Solid-State Circuits Conference (ESSCIRC 2009)] / European Solid-State Device Research Conference (ESSDERC) ; 14-18 September 2009, Athens, Greece / Tsoukalas, Dimitris; Dimoulas, Athanasios (Hrsg.) 2009, S. 181 - 184Online Volltext: dx.doi.org/
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The geometric design of microbolometer elements for uncooled focal plane arraysIn: Infrared Technology and Applications XXXIII: 9 - 13 April 2007, Orlando, Florida, USA / Conference on Infrared Technology and Applications ; 9 - 13 April 2007, Orlando, Florida, USA 2007 654223Online Volltext: dx.doi.org/
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A new method to determine the tool count of a semiconductor factory using FabSimIn: Proceedings of the 2004 Winter Simulation Conference: vol. 2 / Winter Simulation Conference (WSC) ; December 5 - 8, 2004, Washington, D.C., USA / Ingalls, Ricki G.; Rossetti, Manuel D.; Smith, Jeffrey S.; Peters, Brett A. (Hrsg.) 2004, S. 1925 - 1929Online Volltext: dx.doi.org/
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Investigation of the spatial distribution of current density and heat dissipation in high-power-semiconductor devicesIn: Area array packaging technologies: Fourth International Workshop on Area Array Packaging Technologies, April, 22-23, 2002, Berlin, Germany / International Workshop on Area Array Packaging Technologies ; April, 22-23, 2002, Berlin, Germany 2002 [10 Bl.]
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Smart power integration on SOI : thin and thick film (local) SOI processes and devicesIn: CIPS 2000: International Conference on Integrated Power Systems, June 20 - 21, 2000, Bremen, Germany / International Conference on Integrated Power Systems (CIPS) ; June 20 - 21, 2000, Bremen, Germany 2000, S. 20 - 29
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Single-chip class-E converter for compact fluorescent lamp ballastIn: 1997 IEEE International Solid-state Circuits Conference: Digest of technical papers / IEEE International Solid-state Circuits Conference (ISSCC) ; February 6 - 8, 1997, San Francisco, Calif., USA / Wuorinen, John H. (Hrsg.) 1997, S. 378 - 379Online Volltext: dx.doi.org/
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Smart power with 1200V DMOSIn: ISPSD '97: 1997 IEEE International Symposium on Power Semiconductor Devices and ICs ; lectures held at the ETG-Conference ; May 26 - 29,1997 in Weimar, Germany / IEEE International Symposium on Power Semiconductor Devices and ICs (ISPSD) ; May 26 - 29,1997, Weimar, Germany 1997, S. 317 - 320Online Volltext: dx.doi.org/
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A CMOS image sensor with combined analog nonvolatile storage capabilityIn: 1996 International Electron Devices Meeting: San Francisco, CA, December 8 - 11, 1996 / International Electron Devices Meeting (IEDM) ; December 8-11, 1996, San Francisco, Calif. 1996, S. 923 - 926Online Volltext: dx.doi.org/
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An intelligent vertical trench DMOS on SIMOX-substrateIn: 8th International Symposium on Power Semiconductor Devices and ICs: ISPSD '96 ; Proceedings / International Symposium on Power Semiconductor Devices and ICs (ISPSD) ; May 20 - 22, 1996, Maui, Hawaii, USA / Salama, C. A. T.; Williams, R. K. (Hrsg.) 1996, S. 177 - 180Online Volltext: dx.doi.org/
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Ein monolithischer PWM-Dimmer für Automobilanwendungen in SIMOX-TechnologieIn: Mikroelektronik: Vorträge der GME-Fachtagung vom 20. bis 22. März 1995 in Baden-Baden / GME-Fachtagung Mikroelektronik ; 20. bis 22. März 1995, Baden-Baden / Barke, Erich (Hrsg.) 1995, S. 393 - 398
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Qualitätssicherungsstrategie bei der Kleinserienfertigung von Wasserstoffsensoren auf der Basis von MOS-BauelementenIn: Tagungsband zur Forschungstagung Qualität '95 / Forschungstagung Qualität ; 12. Oktober 1995, Frankfurt, Main 1995, S. 159 - 166
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A bulk-JFET and CMOS/SIMOX technology for low noise, high speed charge-sensitive amplifierIn: 1993 IEEE International SOI Conference: Proceedings ; October 5-7, 1993, the Autry Resort, Palm Springs, California / IEEE International SOI Conference ; October 5-7, 1993, Palm Springs, California, USA / Scott, John (Hrsg.) 1993, S. 186 - 187Online Volltext: dx.doi.org/
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An intelligent 600 V vertical IGBT on SIMOX substrateIn: ESSDERC '93: proceedings of the 23rd European Solid State Device Research Conference, Grenoble, France, 13-16 September 1993 / European Solid State Device Research Conference (ESSDERC) ; 13-16 September 1993, Grenoble, France / Borel, Joseph (Hrsg.) 1993, S. 879 - 882
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Monolithischer Phasenabschnitt-Dimmer in 500-V-SIMOX-TechnologieIn: Mikroelektronik: Vorträge der GME-Fachtagung vom 8. bis 10. März 1993 in Dresden / GME-Fachtagung Mikroelektonik ; 8. bis 10. März 1993, Dresden / Seitzer, Dieter (Hrsg.) 1993, S. 265 - 269
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Smart power technology with dielectric insulation \textless1\textgreater : Processes and applicationsIn: 3rd Mideuropean Symposium and Exhibition on Semiconductor Engineering and Technology SET '92: October 12 - 14, 1991 in Warsaw, Poland / Mideuropean Symposium and Exhibition on Semiconductor Engineering and Technology (SET) ; October 12 - 14, 1991, Warsaw, Poland / Jakubowski, A. (Hrsg.) 1993, S. 63 - 65
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A 50 V smart power process with dielectric isolation by SIMOXIn: International Electron Devices Meeting 1992: San Francisco, CA, December 13 - 16, 1992 ; Technical digest / International Electron Devices Meeting (IEDM) ; December 13 - 16, 1992, San Francisco, CA, USA 1992, S. 225 - 228Online Volltext: dx.doi.org/
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An intelligent 500 V power vertical DMOS on SIMOX substrateIn: Proceedings of the Fifth International Symposium on Silicon-on-Insulator Technology and Devices / International Symposium on Silicon-on-Insulator Technology and Devices ; May 17 - 22, 1992, St. Louis, Missouri / Bailey, Wayne E. (Hrsg.) 1992, S. 77 - 88
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Integration of vertical/quasivertical DMOS, CMOS and bipolar transistors in a 50V SIMOX processIn: Solid state device research 92: proceedings of the 22nd European Solid State Device Research Conference, ESSDERC '92, 14 - 17 September 1992, Leuven, Belgium / European Solid State Device Research Conference (ESSDERC) ; 14 - 17 September 1992, Leuven, Belgium / Maes, Herman E.; Mertens, R. P.; van Overstraeten, R. J. (Hrsg.) 1992, S. 733 - 735
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Novel approach to defect etching in thin film SOIIn: Proceedings of the Fifth International Symposium on Silicon-on-Insulator Technology and Devices / International Symposium on Silicon-on-Insulator Technology and Devices ; May 17 - 22, 1992, St. Louis, Missouri / Bailey, Wayne E. (Hrsg.) 1992, S. 251 - 258
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SIMOX, an efficient etch-stop to fabricate silicon membranes with well defined thicknessIn: Proceedings of the Fifth International Symposium on Silicon-on-Insulator Technology and Devices / International Symposium on Silicon-on-Insulator Technology and Devices ; May 17 - 22, 1992, St. Louis, Missouri / Bailey, Wayne E. (Hrsg.) 1992, S. 403 - 408
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SIMOX-devices for analog circuitsIn: 1991 IEEE International SOI Conference Proceedings / IEEE International SOI Conference ; October 1 - 3, 1991, Vail Valley, Colorado, USA / Duffy, Michael T. (Hrsg.) 1991, S. 168 - 169Online Volltext: dx.doi.org/
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Batch process for the production of single crystal silicon membranes by the use of SIMOX-wafersIn: Technical digest / MME '90, Micromechanics Europe 1990: 2nd Workshop on Micromachining, Micromechanics and Microsystems, Berlin, Germany, 26 - 27 November 1990 / Workshop on Micromachining, Micromechanics and Microsystems (MME) ; 26 - 27 November 1990, Berlin, Germany 1990, S. 31 - 35
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Characterization of CMOS-devices and circuits built on SIMOX substratesIn: Proceedings of the Fourth International Symposium on Silicon-on-Insulator Technology and Devices: International Symposium on Silicon-on-Insulator Technology and Devices ; May 8 - 11, 1990, Montreal, Quebec, Canada / Schmidt, Dennis N. (Hrsg.) 1990, S. 518 - 523
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Smart-Power-Schalter mit integrierter, dielektrisch isolierter CMOS-AnsteuerungIn: BICMOS und Smart Power: Anwendungen, Stand, Perspektiven ; Vorträge der GME-Fachtagung 6. bis 7. Februar 1990 in Bad Nauheim / GME-Fachtagung BICMOS und Smart Power ; 6. bis 7. Februar 1990, Bad Nauheim / Zimmer, Günter (Hrsg.) 1990, S. 155 - 161
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Temperature behaviour of CMOS devices built on SIMOX substratesIn: ESSDERC 90: 20th European Solid State Device Research Conference, Nottingham, 10-13 September 1990 / European Solid State Device Research Conference (ESSDERC) ; 10-13 September 1990, Nottingham, UK / Eccleston, W.; Rosser, P. J. (Hrsg.) 1990, S. 449 - 452
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Rauscharme und strahlungsfeste JFET - CMOS Auslese-VerstärkerIn: Mikroelektronik: (bisher "Großintegration") ; Vorträge der GME-Fachtagung vom 13. bis 15. März 1989 in Baden-Baden / GME-Fachtagung Mikroelektronik ; 13. bis 15. März 1989, Baden-Baden / Strack, Hans (Hrsg.) 1989, S. 133 - 138
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