• milling angles between 0° and 10°
• production of large, clean, electron transparent areas (typical: 1mm²)
• sample reducable to thicknesses of about 50 +/- 10 nm
• typically used for metallic bulk samples, isolating / semiconducting samples possible
• max. start thickness: 100 nm
• preparation under 10^-4 mbar Ar vacuum condition

Contact:
M. Acet

• Ar atmosphere at ambient pressure
• Temperatures up to 2000°C
• watercooled Cu-cruicible
• usable for almost all metals for producing Heusler alloys

• Well: Precision diamant wire saw Type: 3242
• minimum diamant cutting wire diameter of about 0.2 mm
• cut width of 0.1 mm possible
• usable for all non smearing materials

• Wirtz WoCo50p diamant saw for materials
• maximum cutting depth: 10 mm
• maximuum blade diameter: 120 mm
• usable for all non smearing materials


• Buehler grinder polisher type Phoenix Beta
• dual sliding and polishing machine
• used for pre-preparation for PIPS

• Gatan ultrasonic disc cutter model 601
• for milling 3 mm discs for TEM samples


• Gatan precision dimple grinder model 656
• pre-preparation for PIPS